PENGEMBANGAN METODE ELEKTRODEPOSISI UNTUK PENGAMBILAN KEMBALI PERAK DARI LIMBAH FOTORONTGEN

Authors

  • Yeti Kurniasih IKIP Mataram

DOI:

https://doi.org/10.26740/icaj.v2n2.p12-18

Keywords:

separation of silver, electrodeposition, photorontgen waste

Abstract

Silver in its ionic form is one of the heavy metals dangerous if it is discharged into the environment or into the body of humans or other living things. Silver metal pollution sources, one of which comes from waste fixer which is a waste from the photorontgen process. However, silver in its metal form has a high economic value. Therefore, the development of techniques or methods of recovering silver from the waste solution and turning it into a metal form is important to do so that the metal does not pollute the environment and can be reused economically. One method that can be done is by electrolytic deposition or electrodeposition in which silver in the form of a silver thiosulfate complex compound in the photorontgen waste is converted to Ag metal through a redox reaction. To obtain good quality and quantity of silver deposits in the electrodeposition process, it is necessary to optimize several factors that influence, among others, optimization of potential difference, time and pH of the solution. This study aims to determine the effect of potential difference, time and pH of the solution on the efficiency of the electrodeposition process. Electrodeposition efficiency was determined based on the percentage of reduced silver mass calculated from the decrease in Ag concentration in photorontgen waste solution before and after the electrodeposition process. Based on the results of the study obtained the optimum electrodeposition process at a potential difference of 8 V for 75 minutes and the pH of the waste is 3, where the mass percent of silver which is reduced from waste is 86.49%.

References

[1] Ekpunobi, U.E. Okwukogu, O.K. Anozie, A.I. Ogbuagu, A.S. Ajiwe, V.I and C.I Nweze. œDeposition and Characterization of Silver Oxide from Silver Solution Recovered from Industrial Waste. American Chemical Science Journal. Volume 3 (3) : 307-313.2013.
[2] Modi, Ashish. Kishan Shukla. Jaimin Pandya. Kalpesh Parmar. œ Extraction of Silver from Photographic Waste. International Journal of Emerging Technology and Advaced Enginering.Volume 2.Issue 11. P. 599-606. 2012.
[3] Masebinu, Samson O. And Edison Muzenda. œ Review of Silver Recovery Techniques from Radiographic Effluent and X-ray Film Waste. Proceedings of The World Congress on Enginering and Computer Science 2014, volume (2), 2014.
[4] Shankar, S., S.V. More, R. Seeta Laxman. œRecovery of Silver from Waste X-ray Film by Alkaline Protease from Conidiobolus coronatus. Katmandu University Journal of Science, Engineering and Technology, volume (6), pp. 60-69. 2010.
[5] Widayatno, Tri. Linggar T Gupita. Senja Imaswati dan Pahlawani Novitasari. œRecovery Logam Perak dari Limbah Cair Bekas Pencucian Fotorontgen : Karakterisasi Elektrokimia. Simposium Nasional RAPI XV FT UMS. 2016.
[6] Djunaedi, M.C., D.S. Widodo dan S. Anwar.œ Recovery Perak dari Limbah Fotografi melalui Membran Cair Berpendukung dengan Senyawa Pembawa Asam Di-2-etil Heksil Posfat (D2EHPA). Reaktor, volume (11), pp. 98-103. 2007.
[7] Mahesti, Dwi. Nurrohmah. Kajian Recovery Logam Perak dari Limbah Fotografi Menggunakan Asam Organik dari Limbah Buah dan Sayur sebagai Reduktor dan pengaruh Penambahan Gas N2. Tesis Universitas Gajah Mada. 2014.
[8] Marwati, Siti. œPengaruh Agen Pereduksi dalam Proses Elektrodeposisi terhadap Kualitas Deposit Cu dan Ag.,Jurnal Pendidikan Kimia Yogyakarta, pp.1-5. 2013.
[9] Agustin, W., Ambardi, P., dan Prajitno, D.H. œElektrodeposisi Lapisan Komposit Cu-Al2O3 Dalam Larutan Cuso4 Yang Didoping Partikel Nano Al2O3. Jurnal Sains Materi Indonesia. Volume 14(4), pp. 272-276. 2013.
[10] Topayung, Daud. œPerngaruh Arus Listrik dan Waktu Proses terhadap Ketebalan dan Massa Lapisan yang Terbentuk pada Proses Elektroplating Pelat Baja. Manado :Jurnal Ilmiah Sains, volume 11(1), pp.98-101. 2011.
[11] Kim., J.Y., Yu, J., Lee, J.H, and Lee, T.Y. œThe Effect of lectroplating Parameters on the Composition and Morphology of Sn-Ag Solder. Journal of Electronic Materials. Volume 33(12), pp.145-1464. 2004.
[12] Marwati, S. dan Padmaningrum, R.T. œOptimasi Kondisi Elektrodeposisi Ion Cu2+ Pada Electroplating Limbah Cair Dengan Formaldehid Sebagai Agen Pereduksi.J. Sains Dasar 2016, volume5(1), pp. 62 70. 2016.

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Published

2019-03-19

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